Nintendo has done what it never has done before: Reveal how one of their consoles was built from the ground up and do it in an "Iwata Asks" with the developers themselves.
You really owe it to yourself to read the interview in it's entirety to see just how difficult and how much very hard work went in to building the Wii U console, and how proud they are of what they accomplished with the finished product.
7 comments:
small blob tri-core powerpc 400 broadway cores large blob gpgpu with 32mb edram and a dsp and likely a ARM
its the same as wii design but noew wiiu and its a system on die only the main ram sits on the motherboard
YES I CALLED IT YEARS AGO
Small correction: Gpu, cpu and the rest are soldered together on the substrate, not on the die. Why they call it mcm (multi chip module)
System on package mcm need clock speeds and gpu info likely 8rops 24 to 32 texture units around 400 shaders guessing
is that 4 ram chips leading into the mcm
4 x 512mb chips of the same or 2 types of dram maybe all gddr3 or gddr3 and 5 or gddr3/5 and some low end drr2 like a iphone ram or something
i bet its one fast one slow and each 1gb is mKE OF 2 512MB CHIPS giving total 4 x ram chips
Small correction: Gpu, cpu and the rest are soldered together on the substrate, not on the die. Why they call it mcm (multi chip module)
WHAT THE HELL ARE YOU SMOKING
clearly the gpu dsp likely arm cpu and then the cpu are all on the same die thats a mcm the board houses external stiff like main ram flash and wifi
not the chip set !!!!!!!!!!!! or edrasm or catch
"clearly the gpu dsp likely arm cpu and then the cpu are all on the same die thats a mcm the board houses external stiff like main ram flash and wifi "
I said the Motherboard is the mcm. No. There is a different between die and mcm.
Look at the first picture (mcm) in the article. You see three dies and a few capacitors on the green plastic called substrat. The biggest one is the gpu with 32MB embedded ram. The smaller one is the cpu. But we don´t know what third one is. Maybe an ARM core, the audio dsp or a EEPROM. We don´t know it.
If you don´t know what a die is. Look at this article:
http://en.wikipedia.org/wiki/Die_%28integrated_circuit%29
So, can someone tell whats the Wii U is capable of? full specs for AMD HD series and IBM Power based CPU? ok, less overheating (obivious), amd and ibm worked together (obivious), "balanced system"? (hmm maybe obivious), what about speed etc?
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